| No |
Name of
Student |
Project
Title |
| 1 |
TAN WUI HONG |
Study of Molding
Compound Formulations for Possible Applications
in Electronic Packaging |
| 2 |
HAN HUIRONG |
Thermal Processing
on the Material Properties of Epoxy Encapsulant
for Integrated Circuits |
| 3 |
LIM HUI PING,JOANNA |
Reliability of Cu/Low-k
Dielectric Systems |
| 4 |
LEE CHIN YANG,
MARCUS |
Reliability Study of
Copper Dual Damascene Interconnects with
Different Cap Layers |
| 5 |
CHENG MEI HWEI |
Joule-Heating
Effects of Copper Interconnects Under AC
Condition |
| 6 |
I MADE RIKO |
Development of Test
Methodology for Wafer-Level Reliability
Characterization |
| 7 |
KOH LI BUAY, MAY |
Failure Analysis of
Semiconductor PN Junction |
| 8 |
ONG SIEW ENG |
Evaluation of
Adhesion Strength of Bonded Cu-Cu Interfaces |
| 9 |
FARAH BTE ABD MALIK |
Investigation of Cu-Cu
Bonding in a Cu/Low-k Damascene System Using
Destructive Shear Test |
| 10 |
KHIK SIN CHAI |
Electroless
Deposition of Ni Nanowires through Anodized Al
Template |
| 11 |
YANG HUIWEN, LYANNE |
Electrodeposition of
Cu Nanowires through Anodized Al Template |
| 12 |
CHO JIE YING |
Fabrication of Rare
Earth-Based Nanoparticles |
| 13 |
CHUA YUEH ANG |
Fabrication of Rare
Earth-Based Nanostructures |