| No
|
Name
of Student |
Project
Title |
| 1 |
Lim Wei Jie |
Compositional dependence of Sn-Bi solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales |
| 2 |
Lim Shuyi Iris |
Synthesis of Cu nanostructures for interconnections |
| 3 |
Ding Hui Fang |
Synthesizing of Cu nano wires using Anodic Aluminium Oxide (AAO) |
| 4 |
Muhammad Ridhwan Bin Md Yusoff |
Synthesis of borate-based epoxy molding compound for radiation hardened electronics packaging |
| 5 |
Fransisca Kho |
Electrical characterization of compositional changes in Ag-In solder for harsh environment electronics packaging |
| 6 |
Timothy Santika |
Development of one-dimensional zirconia nanomaterials |
| 7 |
Chen Weida, Eric |
Synthesis and mechanical properties of Cerium stabilized ZrO2 nanofibers |
| 8 |
Do Dai Duong |
Development and characterization of SiO2 based materials as potential shape memory materials |
| 9 |
Tan Khim Hong |
Backside sample preparation for failure analysis of ICs |
| 10 |
Lee Hui Xuan Jasmin |
Frontside sample preparation for failure analysis of ICs |
| 11 |
Steven |
Mechanical failure study of electronic packages under high pressure and high temperature environments |
| 12 |
Guo Kai Kai |
Characterization of high temperature polymers |
| 13 |
Maria Yulinda |
Characterization of high temperature polymers for harsh environment |
| 14 |
Stephen Carlson Wijaya
|
Mechanical testing for high temperature polymers
|