| No |
Name of
Student |
Project
Title |
| 1 |
Lim Meng Keong |
Electromigration
Study of Advanced Cu-based Interconnects |
| 2 |
Liu Mei Jun
Jolene |
Electromigration
Study of Cu-based Interconnects |
| 3 |
Yang Ying |
Reliability Study of
Cu-based Interconnects under AC Condition |
| 4 |
Zhu Zhu |
Oxidation Kinetics
Study of CoWP-Capped Cu Interconnect |
| 5 |
Zhang Rou |
ESD Reliability
Analysis of Cu/low-k Interconnects |
| 6 |
Jesica |
V-Ramp and TDDB
Reliability Analysis of Cu/low-k Dielectrics |
| 7 |
Lim Boon Hsien,
George |
Fabrication and
Characterisation of CNT Low-k Dielectrics |
| 8 |
Yang Lin' Tanya |
Thermal Conductivity
Characterization of CNT Low-k Dielectrics |
| 9 |
Lee Kwang Hong |
Thick Porous Alumina
Process on Silicon |
| 10 |
Wong Mee Mee |
Formation of ordered
Al2O3 nanopores in Al foil for template
patterning |
| 11 |
Liu Hongping |
Fabrication of Rare
Earth-based Nanoparticles |
| 12 |
Chen Zhihui
Adeline |
Fabrication of Rare
Earth-based Nanoparticles |
| 13 |
Soh Wee Li |
Evaluation of
Adhesion Strength of Bonded Cu-Cu Interfaces |
| 14 |
Ong Xuefen |
Reliability of
Bonded Cu-Cu Interfaces under Thermal Cycling |
| 15 |
Jim Shi Qian |
Copper film
Structure Study at Different Annealing Conditions
|
| 16 |
Chia Yoon Fee |
Investigation of Low
k/Ultra Low-k Hybrid Stack Dielectrics |
| 17 |
Huang Qiu Mei |
Characterization of
Adhesive Films for Driver Chip Interconnect
Applications in Liquid Crystal Displays |