| No |
Name of
Student |
Project
Title |
| 1 |
Wardhana Aji
Sasangka |
Oxidation Kinetics
of CoWP-Capped Cu Interconnects |
| 2 |
Eng Mai Leng |
TDDB Reliability
Analysis of CoWP-capped Cu/Low-k Interconnects |
| 3 |
Goh Mei Yun
Gillian |
Evaluation of
Adhesion Strength of Dielectric Materials in Cu/Low-k
Interconnect |
| 4 |
Kim Shew Fern Shandy |
Fabrication and
Electrical Characterization of CNT Low-k
Dielectrics |
| 5 |
Lim Wanni |
Fabrication and
Thermal Conductivity Characterization of CNT Low-k
Dielectrics |
| 6 |
Wong Wei Lian Winnie |
Evaluation of
Adhesion Strength of Bonded Cu-Cu Interfaces
under Different Bonding Temperature |
| 7 |
Jiang Xiaojuan |
Evaluation of
Adhesion Strength of Different Bonded Cu-Cu
Interfaces |
| 8 |
Teo Say Poon |
Evaluation of
Adhesion Strength of Different Thickness of
Bonded Cu-Cu Interfaces |
| 9 |
Yu Jian |
Nanoprobing for
Transistor Characterization and Fault Isolation
at Chip Level |
| 10 |
Ong Beng Sheng |
Fabrication of
Patterned Metallic Nanowire Array using Anodic
Alumina Oxide Template |
| 11 |
Teh Seok Hui
Geraldeen |
Fabrication of
Metallic Nanowires for Off-Chip Interconnects |
| 12 |
Hoon Ang How |
Formation of
Different Sized AAO Nanopores in Al Film for
Nanowires Growth |
| 13 |
Tan Si Jia |
Electrodeposition of
Metallic Nanowires through AAO Nano-Template |
| 14 |
Foo Li Ying |
Fabrication of Rare
Earth-Based Nanowires through AAO Nano-Template |
| 15 |
Tian Yutian |
Property Study of
Phase Change Materials for Optical Media |
| 16 |
Tung Sze Hwee |
Patterning
Technology Development using Phase Change
Materials |
| 17 |
Lim Wee Han Ronald |
Study of
Crystallization Behaviour of Phase Change
Materials |
| 18 |
Intan Ayu
Perwitasari |
Investigation on
Nano Phase Change on PCRAM Cell |