| No
|
Name
of Student |
Project
Title |
| 1 |
Wang
Wei |
Modeling
the electromigration induced atomic flux in
confined copper interconnects |
| 2 |
Ong
Wey Shi |
Simulation
of pulsed DC electromigration |
| 3 |
Chia
Hong Ling |
Au-Au
bonding for 3D ICs and heterogeneous systems |
| 4 |
Nur
Hafizah Bte Mokzi |
Low
temperature bonding for MEMS System-In-Package (SIP) |
| 5 |
Tan
Kai Yeow |
Fine
pitch chip-on-chip interconnection study |
| 6 |
Tan
Ying Xuan |
Fabrication
and study of nanoscale solder for nanoelectronics
interconnect |
| 7 |
Ricolas
Wongso |
Fabrication
of highly ordered anodic alumina oxide for
imprinting templates |
| 8 |
Zhang
Cheng |
Characterization
and electrical properties of Au-ZnO-Au
heterojunction nanowires |
| 9 |
Koh
Shi Wei Janice |
Hydrothermal
synthesis of rare earth hydroxide and oxide
nanotubes |
| 10 |
Jayang |
Property
study of phase change mask layers used in Super-RENS |
| 11 |
Tan
Kar Wei |
Property
study of non-chalcogenide phase change materials
for optical media |
| 12 |
Toh
Kah Long |
Performance
study of ferromagnetic materials for optical
media |
| 13 |
Lim
Cheng Huat |
Property
study of ferromagnetic materials for optical
media |
| 14 |
Khoo
Chee Ying |
Property
study of phase change materials for
nanopatterning |
| 15 |
Siti
Khairunnisa Binte Ghani |
Phase
change materials for nanopatterning |