| No
|
Name
of Student |
Project
Title |
| 1 |
Chan
Wei Shan |
Fabrication
of Ag nanowire arrays using Anodic Aluminum Oxide
(AAO) as the template |
| 2 |
Lee
Wee Keong |
Investigation
on intermetallic formation in nanoscale solder |
| 3 |
Seah
Geok Leng |
Fabrication
and electrical characterization of metallic
nanowires via nanoporous alumina template |
| 4 |
Neo
Bao Ling |
Investigation
on electromigration behavior of metallic
nanowires |
| 5 |
Lin
Jingyuan |
Modeling
the electromigration induced atomic flux in
confined copper interconnects |
| 6 |
Ong
Zi Xuan, Sharon |
Investigation
on electromigration-induced bond improvements on
3D bonded interconnects |
| 7 |
Tee
Han Yun |
Effect
of thermal aging on low temperature bonding
solders for 3D devices |
| 8 |
Feng
Famin |
Study
on low temperature bonding solders for 3D
integrated circuit |
| 9 |
Ng
Mei Zhen |
Delayering
of copper and low-? dielectrics for semiconductor
devices failure analysis |
| 10 |
Eng
Wee Hock |
Modeling
of thermal behavior in phase change interconnects |
| 11 |
Tan
Sok Hong |
Investigation
of metallic glass as recording layer |
| 12 |
Chan
Kin Wai, Clarence |
Investigation
of metallic glass as recording layer |
| 13 |
Wong
Hsien Han |
Investigation
of metallic glass as thermal absorption layer for
laser thermal lithography |