| No
|
Name
of Student |
Project
Title |
| 1 |
Hazel Pah Pei Lin |
Electromigration reliability study of metallic nanowires |
| 2 |
Muhammad Afiq Bin Sani |
Hermetic sealing of MEMS sensors for high temperature electronics |
| 3 |
Angela Goh Ee Ping |
Graphite oxide/polymer nanocomposite film as gate insulators |
| 4 |
Shirlynn Khoo Ling |
Microassembly of wireless implantable neuroprobe microsystem for neuroprosthetics |
| 5 |
Ong Wee Siang |
Fabrication and study on the electric properties of phase change nano-dots |
| 6 |
Chang Jun Hua |
AlN Ceramics substrate fabrication and characterization for high pressure and temperature electronics |
| 7 |
Koh Lihui |
Development and Characterization of Multi-Chip Embedded Wafer Level Packages (EMWLP) |
| 8 |
Ler Mei Shi Jolene |
Characterisation of Packaging Material for High Performance Package |
| 9 |
Lee Meixuan Michelle |
Floating Gate Memory Sample Preparation of Sub-Micron Technology Node ICs |
| 10 |
Siah Yu Wen |
Cu metallization and dielectric removal for failure analysis of ICs |
| 11 |
Lim Xin E |
Electrical characterization of low temperature bonding via copper nanowires for 3D ICs |
| 12 |
Leong Sook Yin, Sharon |
Al2O3 Ceramics substrate fabrication and characterization for high pressure and temperature electronics |
| 13 |
Wong Wan Teng |
Characterization on copper protrusion on Cu-filled through silicon vias (TSVs) after annealing |
| 14 |
Serene Low Mei Jun |
Electrical characterization of copper/low-k dielectrics test structures |
| 15 |
Leu Su Wen |
Fabrication and characterization of copper nanowires-solder interconnection |