| No
|
Name
of Student |
Project
Title |
| 1 |
Chan Suet Kheng |
Mechanical reliability of electronic packages under adverse environment |
| 2 |
Kee Yan Lin |
High temperature polymeric gap fill materials for electronic packages |
| 3 |
Lim Wei Fong Sebastian |
Study on the adhesion and reliability of high temperature plastic encapsulants |
| 4 |
Clare Huang Guanqi |
Performance evaluation of a tailor-made glass frit die attach/hermetic sealing for high temperature application |
| 5 |
Ong Wei Chuan |
Transient liquid phase (TLP) die attach for high-temperature devices |
| 6 |
Tan Kay Wen |
Development of non-destructive thin metal film adhesion |
| 7 |
Hong Yujing, Claire |
Cu metallization removal for failure analysis of ICs |
| 8 |
Leong Han Quan |
Package decapsulation for failure analysis of ICs |
| 9 |
Ronald Kristianto |
Graphene growth through segregation method |
| 10 |
Vincent Sebastian Hidajat |
Compositional dependence of Sn-Zn solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales |
| 11 |
Zhou Yingxiu |
Compositional dependence of Sn-Bi solder on the intermetallic compound (IMC) growth kinetics with Cu at thin film scales |