| No
|
Name
of Student |
Project
Title |
| 1 |
Foo
Jie Sheng |
Study
on kinetics of IMC formation through simple in-situ
experiments for 3D IC applications |
| 2 |
Aw
Jie Li |
Electrical
characterization of Indium-based solder bonding
for 3D IC applications |
| 3 |
Yeow
Su Yi Susan |
Investigation
on low temperature bonding via copper nanowires
for 3D ICs |
| 4 |
Nadia
Bte Eddy Razali |
Electrical
characterization of low temperature bonding via
copper nanowires for 3D ICs |
| 5 |
Ng
Boon Earn |
Fabrication
and electrical characterization of metallic
nanowires via nanoporous alumina template |
| 6 |
Ding
Hui Jun |
Chemical
functionalization of single-walled carbon
nanotube for carbon-based thin film transistors |
| 7 |
Lau
Fu Long |
Physical
and electrical failure analysis of Cu/low k
interconnect system |
| 8 |
Lee
Yi Xuan |
Fault
Isolation of 3D Multi-Die/Package Stacked
Technology |
| 9 |
Zhuo
Guoping |
How
reliable are 3-D chipstacks using Through Silicon
Vias (TSV)? |
| 10 |
Lee
Ming Kian |
Parallel
assembly technique for thin chip using guided
self-assembly |
| 11 |
Leong
Wai Lup |
Microassembly
of wireless implantable neuroprobe microsystem
for neuroprosthetics |
| 12 |
Lim
Shyh Horng |
Characterization
of giant-magnetoresistance devices for magnetic
field sensing and data storage |