[ News Update ]

• Details on FYP for AY 2015/16 can be found on the FYP page.

[ Research Focus ]

The focus of Gan’s research group encompasses different aspects of the interconnect technology, from the micro to nano-scale.

• Reliability study of state-of-the-art copper interconnect/low-k systems, such as copper electromigration, time-dependent-dielectric-breakdown of low-k dielectrics and new assessment methodology for circuit level reliability projection.
• Characterization and modeling of the mechanical and electrical properties of copper-copper bonds in the realization of 3D interconnects through wafer bonding and through silicon vias. This project also investigates the application of low temperature solders for integration of heterogeneous systems.
• Fabrication of metallic nanowires by a template method as interconnects is also being investigated. Work is carried out to characterize the morphology and electrical properties of the nanowires to assess its suitability for actual applications.