Click to see: : < Collaborators >
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Graduated PhD Students> | < Research Staff>
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Postgraduate Students>
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(Massachusetts Institute of Technology, USA) |
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(Loughborough University, UK) |
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(IBM Microelectronics, USA) |
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(CNES, France) |
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(Singapore University of Design and Technology) |
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(School of MSE, NTU) |
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(School of MSE, NTU) |
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(School of EEE, NTU) |
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(Institute of Microelectronics, A*STAR) |
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(Institute of Microelectronics, A*STAR) |
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(Institute of Microelectronics, A*STAR) |
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(Institute of Microelectronics, A*STAR) |
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(Data Storage Institute, A*STAR) |
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(SIMTech, A*STAR) |
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(Global Foundries Singapore Pte Ltd) |
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(Global Foundries Singapore Pte Ltd) |
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(Global Foundries Singapore Pte Ltd) |
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(Global Foundries Singapore Pte Ltd) |
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(Global Foundries Singapore Pte Ltd) |
Graduated PhD Students <back to top>
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Thesis Electrical
Characterization and Modeling on Mechanical Strength of
Copper to Copper Bonds for Three Dimensional Integrated
Circuits currently at School of Electrical and Electronics Engineering, NTU |
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Thesis
Application of Diluted Magnetic
Semiconductor to Spintronics Devices currently at Temasek Laboratories@NTU |
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Thesis
Dielectric Failure Mechanisms in Advanced Cu/Low-k
Interconnect Architecture currently at Global Foundries Singapore Pte Ltd |
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Thesis
Qualitative Analysis of Mechanical and
Electrical Properties of Cu-Cu Bonds of 3D Integrated
Circuits currently at Global Foundries Singapore Pte Ltd |
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Thesis
Laser Processing of Ga2O3
Micro- and Nanostructures currently at Philips Lumileds Singapore Pte Ltd |
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Thesis
Process Development of Nanowires for Off-Chip
Interconnects" currently at Institute of Microelectronics, A*STAR |
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Research Scientist |
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Research Scientist |
Post Graduate Students <back to top>
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Fabrication and Characterization of Nano-Interconnects through Anodized Aluminum Oxide Template |
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Synthesis and Characterization of Metal-Silicides Nanostructures |
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Electromigration Reliability of Copper Interconnects under Pulsed Current Conditions |
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Investigation on Electromigration of Advanced Copper Interconnect/Low-k Dielectric System |
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Characterization of Cu-Sn-In Thin Films for 3D Heterogeneous System Integration |
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Development of Metallic Nanowires for Chip-Substrate Interconnection |
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"Field Effect Transistors Based on Carbon Nanomaterials" |
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"Reliability Study of Advanced Low-k Dielectrics" |
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"Study on Reconfigurable Interconnects for 3D Devices" |
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"Reliability and Failure Analysis of 3D Interconnections" |
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"Failure Analysis of 3D Multi-Die/Package Stacked Technology" |
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"Development of Metallic Nanowires-Solder Interconnection" |