Prof. Weichen Liu
Weichen Liu (刘韦辰)
Associate Professor

Weichen Liu's research interests lie at the intersection of AI and edge computing, addressing the challenge of building computing systems that are simultaneously intelligent, efficient, and temporally predictable. He develops hardware-aware neural architecture search, structured model compression, and in-memory acceleration techniques to deploy deep learning within tight latency and energy budgets on constrained devices. In parallel, his research spans a broad range of system-level challenges, including real-time scheduling theory, photonic integrated circuit (IC) design, and hardware/software co-design for parallel embedded platforms. His research is supported by Intel, AMD, Xilinx, MediaTek, Huawei, and HP Inc. (more →)

Education

  • PhD — Hong Kong University of Science and Technology
  • MEng — Harbin Institute of Technology, China
  • BEng — Harbin Institute of Technology, China

Employment

  • Associate Professor — Nanyang Technological University (2023–present)
  • Nanyang Assistant Professor — Nanyang Technological University (2018–2023)

Research Interests

  • Efficient Edge Intelligence — hardware-aware neural architecture search (NAS), model compression, mixed-precision quantization
  • Electronic–Photonic IC — silicon photonic interconnects, WDM-based on-chip communication, electronic–photonic co-design
  • In-Memory and FPGA Acceleration — crossbar-based in-memory computing, FPGA deployment pipelines for edge AI
  • Real-Time Embedded Systems — scheduling theory, worst-case response-time analysis, parallel many-core platforms

Selected Honors & Awards

YearAwardVenueLocation
2024Special MentionSingapore Open Research AwardsSingapore
2024Best Paper CandidateDACSan Francisco, CA, USA
2023HiPEAC Paper AwardHiPEACToulouse, France
2023Best Paper CandidateDATEAntwerp, Belgium
2022Best Research AwardSTCAISingapore
2022Best Paper CandidateGLSVLSIIrvine, CA, USA
2022Publicity PaperDACSan Francisco, CA, USA
20203rd PlaceIEEE EDAthonHong Kong
2020Best Poster AwardACM SIGDA Forum @ ASP-DACBeijing, China
2020Best Paper CandidateASP-DACBeijing, China
2019Best Paper CandidateASP-DACTokyo, Japan
2018Nanyang Assistant ProfessorshipNTUSingapore
2017A. Richard Newton Young Student Advisor AwardDACAustin, TX, USA
2017Best Poster PaperRTCSAHsinchu, Taiwan
2017Best PosterACM SIGDA Forum @ ASP-DACChiba, Japan
2016Best Paper CandidateASP-DACMacau, China
2015Best Paper CandidateCASES (ESWEEK)Amsterdam, Netherlands
2010Best Poster AwardAMD Technical Forum & ExhibitionTaiwan
2009Best Paper CandidateCODES+ISSS (ESWEEK)Grenoble, France
2005MediaTek Inc. & Wu Ta-You Scholar AwardMediaTek Inc.Taiwan
Paper added
Current Members
MF
PhD
Since August 2024
BS, Peking University
GX
PhD
Since January 2023
BS, Sichuan University
MS, Harbin Institute of Technology
TM
MPhil
Since August 2024
BEng, Beihang University
JZ
Visiting Master's Student
August 2025 – July 2026
University of Science and Technology of China (USTC)
ZT
Visiting Master's Student
August 2025 – July 2026
University of Science and Technology of China (USTC)
Join Us

We are actively seeking motivated PhD students and Postdoc Research Fellows with a strong interest in edge AI, hardware acceleration, and silicon photonics. Interested applicants are encouraged to submit their inquiries via email. Please note that only shortlisted candidates will be notified.

Note: the research group is currently unable to host overseas interns or visiting undergraduate students who require financial assistance. However, exchange PhD students with institutional support are welcome to enquire.

Alumni
Graduates
NameDegreeYearCurrent Position
Dr. Xiangzhong LuoPubsPhD2023Tenure-Track Associate Professor, Southeast University
Dr. Hao KongPubsPhD2023Scientist, Huawei Technologies, Shanghai
Dr. Shiqing LiPubsPhD2023Researcher, Illinois Advanced Research Center at Singapore (UIUC)
Dr. Shuo HuaiPubsPhD2023Postdoctoral Researcher, NTU
Dr. Shien ZhuPubsPhD2022Postdoctoral Researcher, ETH Zurich
Dr. Hui ChenPubsPhD2022Huawei Top Minds (天才少年) Program, Dongguan
Dr. Peng ChenPubsPhD2021Associate Professor, Chongqing University of Posts and Telecommunications (CQUPT)
Dr. Mengquan LiPubsPhD2020Associate Professor, Hunan University
Dr. Lei YangPubsPhD2019Assistant Professor, George Mason University
Research Staff
NameRolePeriodCurrent Position
Dr. Balasubramanian PadmanabhanPubsSenior Research FellowAug 2022–Apr 2023R&D Consultant (independent)
Dr. Vijaya Bhaskar AdusumilliPubsResearch FellowJan 2023–Oct 2023Assistant Professor, SRM University-AP
Dr. Di LiuPubsResearch FellowJan 2020–Jan 2022Tenured Associate Professor, Norwegian University of Science and Technology (NTNU)
Dr. Jun ZhouPubsResearch FellowApr 2019–Feb 2021Research Engineer, MITECH Corporation, Japan
Dr. Luan H. K. DuongPubsResearch FellowAug 2018–Apr 2021Senior Lecturer, The Ohio State University
Mr. Vikash SathiamoorthyPubsResearch AssociateFeb 2022–Oct 2023Research Data Scientist, NTU Singapore
Ms. Lei ZhangPubsResearch AssociateOct 2019–Jan 2021Algorithm Engineer, Geega Technology
Ms. Wendy Yong Yi LoyPubsProject OfficerNov 2021–May 2023Statistician, Singapore Department of Statistics
Mr. Wenyang LiuPubsProject OfficerApr 2019–Jan 2021PhD Student & Research Associate, NTU Singapore
Visiting Students & Research Interns
NameRolePeriodHome Institution
Mr. Zhaolong JianPubsVisiting PhD StudentMar 2025–Mar 2026Nankai University
Ms. Yili GuoPubsVisiting PhD StudentJan–Dec 2025Hunan University
Ms. Liping YangPubsVisiting PhD StudentJan–Dec 2025Hunan University
Ms. Fenfang LiPubsVisiting PhD StudentSep 2024–Sep 2025Hunan University
Ms. Xiangzhen XiaoPubsVisiting PhD StudentJan–Dec 2024Hunan University
Mr. Yinjie FangPubsVisiting PhD StudentJan–Dec 2024Hunan University
Ms. Bingting JiangPubsVisiting PhD StudentNov 2022–Nov 2023Hunan University
Mr. Haotian WangPubsVisiting PhD StudentSep 2022–Sep 2023Hunan University
Ms. Peiying LinPubsVisiting PhD StudentFeb 2022–Feb 2023Hunan University
Mr. Xinyang DongPubsVisiting PhD StudentMar 2022–Jun 2023Northeastern University
Ms. Shuangshuang ChangPubsVisiting PhD StudentAug 2021–Aug 2022Northeastern University
Mr. Pengxing GuoPubsVisiting PhD StudentOct 2018–Jun 2020Northeastern University → Assistant Professor, CQUPT
Mr. Yuhao JiPubsVisiting UndergraduateOct–Dec 2023Nanjing University → PhD Student, CUHK
Mr. Chunyun ChenPubsVisiting UndergraduateNov 2019–May 2020UESTC → PhD Student, NTU
Mr. Chunhui WuPubsVisiting UndergraduateJul–Aug 2019USTC → PhD Student, USTC
Mr. Fuyuan LyuPubsVisiting UndergraduateSep 2018–Feb 2019SJTU → PhD Student, McGill University
Mr. Kaivalya SwamiPubsVisiting UndergraduateMay–Jul 2019IIT Delhi → DevRev

Courses

CodeCourse TitleLevelTerms
SC1006Computer Organization and ArchitectureUndergraduate2025–present
SC3050Advanced Computer ArchitectureUndergraduate2022–present
SC2079 / CE3004 / CZ3004Multi-Disciplinary ProjectUndergraduate2023–2025
SC2107 / CE2107Microprocessor System Design and DevelopmentUndergraduate2022–2023
CZ3001 / CE3001Advanced Computer ArchitectureUndergraduate2017–2026
CZ3002Advanced Software EngineeringUndergraduate2019–2020, 2022–2023
CZ2006 / CE2006Software EngineeringUndergraduate2018–2020
CZ1006 / CE1006Computer Organisation and ArchitectureUndergraduate2018–2020
CZ2005 / CE2005Operating SystemsUndergraduate2017–2018, 2021–2022

Office hours: by email appointment.

Editorial

PeriodRoleJournal
2026–presentSubject Area EditorIEEE Transactions on Computer-Aided Design (IEEE TCAD)
2022–2025Associate EditorIEEE Transactions on Computer-Aided Design (IEEE TCAD)
2018–presentSubject Area EditorJournal of Systems Architecture (JSA), Elsevier
2024–2025Associate EditorIEEE Embedded Systems Letters (IEEE ESL)
2022–2023Guest EditorACM Transactions on Embedded Computing Systems (ACM TECS) — Special Issue on In/Near-Memory and Storage Computing
2021–2022Guest EditorJournal of Systems Architecture (JSA) — Special Issue on Memory and Storage Computing
2020–2021Guest EditorMicroprocessors and Microsystems (MICPRO) — Special Issue on Memory and Storage Computing
2015–2016Associate EditorJournal of Circuits, Systems and Computers (JCSC), World Scientific Press

Conference Organization

PeriodRoleConference / Event
2026Program Chair44th IEEE International Conference on Computer Design (ICCD)
2025Publication Co-ChairACM/IEEE Embedded Systems Week (ESWEEK)
2024Track Chair (Architecture)International Conference on Networking, Architecture and Storage (NAS)
2023Track Chair (OS Platforms)IEEE International Symposium on Embedded Multicore/Many-core Systems (MCSoC)
2021–2022Program ChairIEEE International Conference on Intelligent Transportation, Infrastructure and Computing (ICITES)
2021–2022Track Chair (Software and Applications)ACM/IEEE International Symposium on Low Power Electronics and Design (ISLPED)
2020–2022General ChairInternational Workshop on Memory and Storage Computing (MSC) @ ESWEEK
2020–2022Organizing CommitteeWorkshop on Edge AI @ IEEE ICDCS
2020General Chair25th IEEE International Symposium on Real-Time Computing (ISORC)
2019–2021General ChairStudent Research Forum (SRF) @ ASP-DAC
2019Program Chair24th IEEE International Symposium on Real-Time Computing (ISORC)
2019Special Session ChairIEEE Computer Society Annual Symposium on VLSI (ISVLSI)
2014Program ChairInternational Workshop on Embedded Multi-Core Systems and Applications

Technical Program Committee

YearsConference
2016–2023, 2026ACM/IEEE International Conference on Hardware/Software Codesign and System Synthesis (CODES+ISSS)
2020–2022, 2026ACM/IEEE Design Automation Conference (DAC)
2014, 2017, 2019, 2026IEEE International Conference on Embedded and Real-Time Computing Systems and Applications (RTCSA)
2026ACM International Conference on Embedded Software (EMSOFT)
2025ACM/IEEE Design, Automation and Test in Europe (DATE)
2016, 2017, 2020–2023ACM/IEEE Asia and South Pacific Design Automation Conference (ASP-DAC)
2019–2022ACM/IEEE International Symposium on Low Power Electronics and Design (ISLPED)
2019, 2020, 2021ACM/IEEE International Conference on Computer-Aided Design (ICCAD)
2021ACM Symposium on Applied Computing (SAC)
2018, 2020IEEE Real-Time Systems Symposium (RTSS)
2020IEEE International Conference on Parallel and Distributed Systems (IEEE ICPADS)
2018, 2019IEEE Real-Time and Embedded Technology and Applications Symposium (RTAS)
YearsConference
2015, 2016, 2019IEEE International Conference on Embedded Software and Systems (ICESS)
2017, 2018ACM Great Lakes Symposium on VLSI (GLSVLSI)
2018ACM/IEEE International Symposium on Networks-on-Chip (NOCS)
2017, 2018ACM/IEEE Student Research Competition @ ICCAD (SRC@ICCAD)
2017IEEE International Conference on Embedded Software Technology and Communication (ESTC)
2015IEEE International Conferences on High Performance Computing and Communications (HPCC)
2015CAD/Graphics Conference
2014International Conference on Networking, Architecture and Storage (NAS)
2014IEEE International Symposium on Embedded Systems Education (SES)
2013International Symposium on Electronic System Design (ISED)
2012IEEE International Conference on VLSI Design

Research Grant Review

PeriodRoleFunding Agency
2016, 2025–2026Expert CommitteeGeneral Research Fund (GRF), Research Grants Council of Hong Kong (RGC)
2025Expert CommitteeCollaborative Research Fund (CRF), Research Grants Council of Hong Kong (RGC)
2015–2017Expert CommitteeNational Natural Science Foundation of China (NSFC)
2017Expert CommitteeNatural Sciences and Engineering Research Council of Canada (NSERC)

Research

The lab's research addresses a single recurring challenge: building systems that are simultaneously intelligent, predictable, and efficient, where any one of these properties is easy to achieve in isolation but all three together impose hard tradeoffs. Every problem in the group, whether it involves scheduling theory, on-chip interconnect design, or deep neural network optimization, can be stated as a resource-allocation problem with a correctness side constraint: given a budget of energy, latency, silicon area, or bandwidth, find a solution that satisfies a timing guarantee, a thermal bound, or an inference accuracy target. The lab develops quantitative methods to navigate this tradeoff, including tight worst-case response-time bounds, measured hardware cost models, and automated search over large design spaces. These methods apply to two problem families that share the same underlying structure: embedded systems that must respond correctly within hard real-time deadlines, such as parallel task schedulers and on-chip communication fabrics; and learned models that must run efficiently on constrained edge hardware, such as hardware-aware neural architecture search and structured compression pipelines. The resource-versus-correctness tradeoff appears in both families, and results from one routinely inform the other.

Research Projects ↓ Research Grants ↓ Publication List ↗ Team Members ↗ Join Us ↗
Research keyword cloud
search space latency budget
Automated DNN Architecture Search and Multi-Dimensional Compression Under Embedded Hardware Constraints

Jointly automating neural architecture search and model compression to produce networks that fit within strict latency, memory, and energy budgets on target embedded hardware. The differentiable NAS line (LightNAS, SurgeNAS, YOSO, Double-Win NAS) reformulates architecture search as a continuous optimization over hardware cost proxies, enabling single-pass search on severely resource-constrained platforms and winning DAC Best Paper recognition in 2024. The compression line (Smart Scissor, EdgeCompress, TAB, CRIMP, Domino-Pro-Max) combines structured spatial pruning, ternary/binary/mixed-precision quantization, and hardware-aligned weight representations to shrink models for crossbar-based in-memory processors and edge SoCs. HACScale further unifies compound scaling with hardware awareness, co-optimizing depth, width, and resolution under a measured latency constraint rather than a proxy FLOPs budget.

Edge AI Neural Architecture Search Model Compression Hardware-Software Co-design Quantization In-Memory Computing
Key Papers
  • Double-Win NAS: Towards Deep-to-Shallow Transformable Neural Architecture Search for Intelligent Embedded Systems DAC 2024
  • Domino-Pro-Max: Towards Efficient Network Simplification and Reparameterization for Embedded Hardware Systems IEEE TCAD 2024
  • EdgeCompress: Coupling Multi-Dimensional Model Compression and Dynamic Inference for EdgeAI IEEE TCAD 2023
  • LightNAS: On Lightweight and Scalable Neural Architecture Search for Embedded Platforms IEEE TCAD 2022
deadline
Latency-Bounded DNN Inference on Embedded Platforms

Deploying deep neural networks on embedded and edge devices under hard latency deadlines, bridging the gap between DNN accuracy and real-time guarantees. Collate partitions inference workloads across edge-cloud boundaries using a collaborative scheduling framework with formal latency bounds. EvoLP introduces a self-evolving latency predictor that refines its own accuracy through online feedback, enabling latency-aware model compression without repeated hardware measurement. ZeroBN eliminates batch normalization layers through zerorization, pruning architectures under per-layer latency constraints derived from target device profiling. A 2024 survey of efficient deep learning infrastructure for embedded computing systems synthesizes deployment methodologies across GPU, FPGA, NPU, and microcontroller targets.

Edge AI Real-Time Systems Deep Learning Hardware Acceleration Latency Modeling
Key Papers
  • Efficient Deep Learning Infrastructures for Embedded Computing Systems: A Comprehensive Survey ACM TECS 2024
  • Latency-Constrained DNN Architecture Learning for Edge Systems using Zerorized Batch Normalization FGCS 2023
  • Collate: Collaborative Neural Network Learning for Latency-Critical Edge Systems IEEE ICCD 2022
  • ZeroBN: Learning Compact Neural Networks For Latency-Critical Edge Systems DAC 2021
4 3 2 1 GPU FPGA ARM NPU throughput (TOPS/W) best
Cross-Platform Benchmarking Infrastructure for Edge AI Accelerators

Rigorous, reproducible evaluation methodology for comparing deep learning deployments across heterogeneous edge hardware. EDLAB is a comprehensive benchmark toolkit covering GPUs, FPGAs, NPUs, and ARM-based SoCs, measuring throughput, energy efficiency, latency, and accuracy under unified workload conditions. The toolkit addresses a fundamental gap: prior edge AI evaluations were conducted on single platforms using inconsistent protocols, making cross-platform comparisons unreliable. EDLAB pairs hardware profiling with a systematic survey of efficient deep learning infrastructures, establishing empirical baselines for future architecture and compression research.

Edge AI Benchmarking Hardware Acceleration Embedded Systems
Key Papers
  • Efficient Deep Learning Infrastructures for Embedded Computing Systems: A Comprehensive Survey ACM TECS 2024
  • EDLAB: A Benchmark for Edge Deep Learning Accelerators IEEE D&T 2021
λ1 λ2 λ3 WDM silicon photonic NoC
Contention-Minimized WDM Routing with Guaranteed Thermal Reliability in Silicon Photonic Networks-on-Chip

Silicon photonic interconnects using wavelength-division multiplexing and micro-ring resonators offer orders-of-magnitude bandwidth density over electrical wires, but micro-ring resonators shift resonance frequency with temperature, making thermal reliability a first-class routing objective. Routing algorithms minimize WDM contention while providing provable thermal reliability guarantees for resonator operating points (ASP-DAC Best Paper Candidate 2019, IEEE TCAD 2021). Hardware-software collaborated thermal sensing embeds micro-ring resonators as thermometers within the NoC fabric, enabling closed-loop monitoring without dedicated sensor overhead (TECS, DATE 2019). An automated optical accelerator search framework (TCAD 2023) applies NAS-style search to photonic hardware, discovering accelerator configurations with superior energy and bandwidth efficiency. MSONoC (2024) extends the design space to metasurface-assisted hybrid waveguide and free-space optical interconnects, and a 3D mesh optical NoC architecture (TCAD 2013) provides foundational topology analysis across multi-die stacks.

Silicon Photonics NoC Embedded Systems WDM Thermal Reliability
Key Papers
  • Automated Optical Accelerator Search Toward Superior Acceleration Efficiency IEEE TCAD 2023
  • Contention-aware Routing for Thermal-Reliable Optical Networks-on-Chip IEEE TCAD 2021
  • Hardware-Software Collaborated Thermal Sensing in Optical Network-on-Chip ACM TECS 2019 / DATE
  • Routing in Optical Network-on-Chip: Minimizing Contention with Guaranteed Thermal Reliability ASP-DAC 2019
S D
Single-Cycle Multi-Hop SMART NoC Design and Thermal-Safe Task Mapping for Dark-Silicon Many-Core Systems

High-performance on-chip interconnect design and power-safe task placement for large-scale multi-core chips, treated as a unified hardware-software co-design problem. The ArSMART line extends SMART NoC to support arbitrary-turn single-cycle multi-hop traversal, proving that contention minimization dominates over hop-count reduction (DAC 2017) and yielding tight worst-case communication latency bounds (TCAD 2021). MARCO provides a task mapping and routing co-optimization framework for point-to-point NoC-based heterogeneous MPSoCs (TECS, CASES 2021), while LAMP introduces load-balanced multipath parallel transmission to raise throughput under heterogeneous traffic. MUGNoC (2023) designs a software-configured multicast-unicast-gather fabric that accelerates CNN dataflow patterns directly in the interconnect. On the dark-silicon side, FoToNoC (ASP-DAC Best Paper Candidate 2016) introduces a folded-torus topology for managing thermally constrained many-core chips, and hardware-software co-optimization frameworks enable selective core activation with DVFS to respect per-chip temperature budgets. A 2025 ML-based approach learns cache coherence traffic patterns to guide adaptive routing decisions.

Embedded Systems NoC Many-Core Hardware-Software Co-design Dark Silicon Thermal Management
Key Papers
  • ArSMART: An Improved SMART NoC Design Supporting Arbitrary-Turn Transmission IEEE TCAD 2021
  • Reduced Worst-Case Communication Latency Using Single-Cycle Multi-Hop Traversal Network-on-Chip IEEE TCAD 2021
  • MARCO: A High-performance Task Mapping and Routing Co-optimization Framework for Point-to-Point NoC-based Heterogeneous Computing Systems ACM TECS 2021 / CASES
  • Task Mapping on SMART NoC: Contention Matters, Not the Distance DAC 2017
T1 T2 T3 T4 T5 C1 T1 T4 T5 C2 T2 T3 D t1 t2 dl
Tight Worst-Case Response-Time Bounds for Parallel DAG Task Graphs on Multi-Core Platforms

Formal schedulability analysis and priority assignment algorithms for parallel real-time tasks modeled as directed acyclic graphs (DAGs), executing under federated and partitioned multi-core scheduling. Key results include a minimum WCRT bound for DAG tasks under prioritized list scheduling (EMSOFT 2022, TCAD), timing-anomaly-free dynamic scheduling for conditional DAGs (TECS, EMSOFT 2019), and locking protocols for parallel tasks sharing semaphore resources under federated scheduling (TCAD 2021). Spin-lock analysis for parallel real-time tasks establishes safe and tight bounds on blocking time under hard real-time constraints (IEEE TC 2021). The FT-DAG generator (2025) provides a full-topology benchmark tool for evaluating DAG scheduling algorithms. SAT-based application mapping on multiprocessor systems (CASES Best Paper Candidate) and schedulability analysis on reconfigurable FPGA hardware complete the formal-methods thread.

Real-Time Systems Embedded Systems Formal Analysis DAG Tasks WCRT Analysis
Key Papers
  • Towards Minimum WCRT Bound for DAG Tasks Under Prioritized List Scheduling Algorithms IEEE TCAD 2022 / EMSOFT
  • Locking Protocols for Parallel Real-Time Tasks with Semaphores under Federated Scheduling IEEE TCAD 2021
  • On the Analysis of Parallel Real-Time Tasks with Spin Locks IEEE TC 2021
  • Timing-Anomaly Free Dynamic Scheduling of Conditional DAG Tasks on Multi-Core Systems ACM TECS 2019 / EMSOFT

Research Grants

ProjectAgencyPeriodRole
AI-Oriented Software Configurable Network-on-ChipMOE AcRF Tier 22025–2028Principal Investigator
Cache Coherence Induced Network-on-Chip Traffic CharacterizationMOE AcRF Tier 12024–2026Principal Investigator
Distanceless Communication Architecture for Many-Core ProcessorsMOE AcRF Tier 22019–2023Principal Investigator
Nanophotonic Platforms for Future Computing SystemsMOE AcRF Tier 12019–2022Principal Investigator
Edge Processor EvaluationNRF IAF-ICP / HP Inc.2018–2023Principal Investigator
Emerging Many-Core ProcessorsNanyang Assistant Professorship2018–2024Principal Investigator
Emerging On-Chip Communication ArchitecturesNTU Start-up Grant2017–2022Principal Investigator