Z.W. Zhong, Doctor of Engineering

Associate Professor

School of Mechanical & Aerospace Engineering

Nanyang Technological University

50 Nanyang Avenue, Singapore 639798

Room : N3-02C-98 Phone : (65) 6790 5588

E-mail : mzwzhong@ntu.edu.sg

Web page: http://www.ntu.edu.sg/home/mzwzhong/

My TEACHING

· M6304, Ultraprecision & Micromachining Processes, Post-graduate (Masters and PhD) course, Lecture

· M6301, Advanced Metrology and Sensing Systems, Post-graduate (Masters and PhD) course, Lecture

· MA2002, Theory of Mechanisms, Under-graduate 2nd year course, Lecture & Tutorial

MAIN RESEARCH INTERESTS

Mechatronics and Design; Manufacturing (precision and ultra-precision engineering, microelectronics packaging); Modelling and Analyses, Air Traffic Management

My Publications

Z.W. ZHONG SELECTED JOURNAL PAPERS with pdf files downloadable

1. S Shamsudin, MA Lajis, ZW Zhong, Solid-state recycling of light metals: A review, Advances in Mechanical Engineering 8(8) (2016) 1-23. DOI: 10.1177/1687814016661921 Open Access: http://ade.sagepub.com/content/8/8/1687814016661921.full.pdf+html (pdf)

2. Chee, KY; Zhong, ZW. Control, navigation and collision avoidance for an unmanned aerial vehicle, SENSORS AND ACTUATORS A-PHYSICAL, Volume: 190, Pages: 66-76, 2013. (pdf)

3. Chauhan, Preeti; Zhong, Z. W.; Pecht, Michael. Copper Wire Bonding Concerns and Best Practices, JOURNAL OF ELECTRONIC MATERIALS, Volume: 42, Issue: 8, Pages: 2415-2434, 2013. (pdf)

4. Zhong, ZW; Wang, ZP; Huang, GXD. Investigation of wax and paper materials for the fabrication of paper-based microfluidic devices, MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, Volume: 18, Issue: 5, Pages: 649-659, 2012. (pdf)

5. Zhong, ZW; Shan, XC. Microstructure formation via roll-to-roll UV embossing using a flexible mould made from a laminated polymer-copper film, JOURNAL OF MICROMECHANICS AND MICROENGINEERING, Volume: 22, Issue: 8, Article Number: 085010, 2012. (pdf)

6. Zhong, ZW. Overview of wire bonding using copper wire or insulated wire, MICROELECTRONICS RELIABILITY, Volume: 51, Issue: 1, Pages: 4-12, 2011. (pdf)

7. Zhong, ZW; Shan, XC; Wong, SJ. Roll-to-roll large-format slot die coating of photosensitive resin for UV embossing, MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, Volume: 17, Issue: 12, Pages: 1703-1711, 2011. (pdf)

8. Zhong, ZW; Song, B; Loh, RE. LCAs of a polycrystalline photovoltaic module and a wind turbine, RENEWABLE ENERGY, Volume: 36, Issue: 8, Pages: 2227-2237, 2011. (pdf)

9. Zhong, ZW; Leong, MH; Liu, XD. The wear rates and performance of three mold insert materials, MATERIALS & DESIGN, Volume: 32, Issue: 2, Pages: 643-648, 2011. (pdf)

10. Zhong, ZW; Shan, XC; Yao, YC. Investigation of Antiadhesive Coatings for Nanoimprinting Lithography, MATERIALS AND MANUFACTURING PROCESSES, Volume: 25, Issue: 7, Pages: 658-664, 2010. (pdf)

11. Zhong, ZW; Song, B; Zaki, MBM. Life-cycle assessment of flash pyrolysis of wood waste, JOURNAL OF CLEANER PRODUCTION, Volume: 18, Issue: 12, Pages: 1177-1183, 2010. (pdf)

12. Zhong, ZW; Venkatesh, VC. Recent developments in grinding of advanced materials, INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, Volume: 41, Issue: 5-6, Pages: 468-480, 2009. (pdf)

13. Zhong, ZW. Wire bonding using copper wire, MICROELECTRONICS INTERNATIONAL, Volume: 26, Issue: 1, Pages: 10-16, 2009. (pdf)

14. Zhong, ZW; Song, B; Huang, CX. Environmental Impacts of Three Polyhydroxyalkanoate (PHA) Manufacturing Processes, MATERIALS AND MANUFACTURING PROCESSES, Volume: 24, Issue: 5, Pages: 519-523, Article Number: PII 909441709, 2009. (pdf)

15. Zhong, ZW. Recent advances in polishing of advanced materials, MATERIALS AND MANUFACTURING PROCESSES, Volume: 23, Issue: 5, Pages: 449-456, 2008. (pdf)

16. Nah, SK; Zhong, ZW. A microgripper using piezoelectric actuation for micro-object manipulation, SENSORS AND ACTUATORS A-PHYSICAL, Volume: 133, Issue: 1, Pages: 218-224, 2007. (pdf)

17. Zhong, ZW; Peng, ZF; Liu, N. Surface roughness characterization of thermally sprayed and precision machined WC-Co and Alloy-625 coatings, MATERIALS CHARACTERIZATION, Volume: 58, Issue: 10, Pages: 997-1005, 2007. (pdf)

18. Goh, KS; Zhong, Z W. Two capillary solutions for ultra-fine-pitch wire bonding and insulated wire bonding, MICROELECTRONIC ENGINEERING, Volume: 84, Issue: 2, Pages: 362-367, 2007. (pdf)

19. Zhong, ZW; Ho, HM; Tan, YC; Tan, WC; Goh, HM; Toh, BH; Tan, J. Study of factors affecting the hardness of ball bonds in copper wire bonding, MICROELECTRONIC ENGINEERING, Volume: 84, Issue: 2, Pages: 368-374, 2007. (pdf)

20. Zhong, ZW; Chan, SY. Investigation of a gripping device actuated by SMA wire, SENSORS AND ACTUATORS A-PHYSICAL, Volume: 136, Issue: 1, Pages: 335-340, 2007. (pdf)

21. Zhong, ZW; Khoo, LP; Han, ST. Prediction of surface roughness of turned surfaces using neural networks, INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, Volume: 28, Issue: 7-8, Pages: 688-693, 2006. (pdf)

22. Zhong, ZW; Zhao, LP; Lin, HH. Development and investigation of an optical tilt sensor, OPTICS COMMUNICATIONS, Volume: 261, Issue: 1, Pages: 23-28, 2006. (pdf)

23. Zhong, ZW; Goh, KS. Investigation of ultrasonic vibrations of wire-bonding capillaries, MICROELECTRONICS JOURNAL, Volume: 37, Issue: 2, Pages: 107-113, 2006. (pdf)

24. Arulvanan, P; Zhong, ZW; Shi, XQ. Effects of process conditions on reliability, microstructure evolution and failure modes of SnAgCu solder joints, MICROELECTRONICS RELIABILITY, Volume: 46, Issue: 2-4, Pages: 432-439, 2006. (pdf)

25. Zhong, ZW; Lin, G. Ultrasonic assisted turning of an aluminium-based metal matrix composite reinforced with SiC particles, INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, Volume: 27, Issue: 11-12. Pages: 1077-1081, 2006. (pdf)

26. Zhong, ZW; Wang, ZF; Tan, YH. Chemical mechanical polishing of polymeric materials for MEMS applications, MICROELECTRONICS JOURNAL, Volume: 37, Issue: 4, Pages: 295-301, 2006. (pdf)

27. Arulvanan, P; Zhong, ZW. Assembly and reliability of PBGA packages on FR-4 PCBs with SnAgCu solder, MICROELECTRONIC ENGINEERING, Volume: 83, Issue: 11-12, Pages: 2462-2468, 2006. (pdf)

28. Tan, J; Zhong, ZW; Ho, HM, Wire-bonding process development for low-k materials, MICROELECTRONIC ENGINEERING, Volume: 81, Issue: 1, Pages: 75-82, 2005. (pdf)

29. Zhong, ZW. Various adhesives for flip chips, JOURNAL OF ELECTRONIC PACKAGING, Volume: 127, Issue: 1, Pages: 29-32, 2005. (pdf)

30. Zhong, ZW; Yang, HB. Development of a vibration device for grinding with microvibration, MATERIALS AND MANUFACTURING PROCESSES, Volume: 19, Issue: 6, Pages: 1121-1132, 2004. (pdf)

31. Zhong, ZW. Ductile or partial ductile mode machining of brittle materials, INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, Volume: 21, Issue: 8, Pages: 579-585, 2003. (pdf)

32. Zhong, ZW. Grinding of aluminium-based metal matrix composites reinforced with Al₂O₃ or SiC particles, INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, Volume: 21, Issue: 2, Pages: 79-83, 2003. (pdf)

33. Gan, J; Wang, X; Zhou, M; Ngoi, B; Zhong, Z. Ultraprecision diamond turning of glass with ultrasonic vibration, INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, Volume: 21, Issue: 12, Pages: 952-955, 2003. (pdf)

34. Zhong, Z; Yip, PK. Finite element analysis of a three-dimensional package, SOLDERING & SURFACE MOUNT TECHNOLOGY, Volume: 15, Issue: 1, Pages: 21-25, 2003. (pdf)

35. Zhong, ZW; Tok, WH. Grinding of single-crystal silicon along crystallographic directions, MATERIALS AND MANUFACTURING PROCESSES, Volume: 18, Issue: 5, Pages: 811-824, 2003. (pdf)

36. Zhong, ZW; Nah, SK. Thermal strain analysis of an electronics package using the SEM Moire technique, SOLDERING & SURFACE MOUNT TECHNOLOGY, Volume: 15, Issue: 3, Pages: 33-35, 2003. (pdf)

37. Chan, KC; Teo, M; Zhong, ZW. Characterization of low-k benzocyclobutene dielectric thin film, MICROELECTRONICS INTERNATIONAL, Volume: 20, Issue: 3, Pages: 11-22, 2003. (pdf)

38. Zhong, ZW; Han, ZZ. Turning of glass with abrasive waterjet, MATERIALS AND MANUFACTURING PROCESSES, Volume: 17, Issue: 3, Pages: 339-349, 2002. (pdf)

39. Zhong, ZW; Hung, NP, Grinding of alumina/aluminum composites, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, Volume: 123, Issue:1, Pages: 13-17, Article Number: PII S0924-0136(02)00075-4, 2002. (pdf)

40. Xie, HM; Asundi, A; Boay, CG; Lu, YG; Yu, J; Zhong, ZW; Ngoi, BKA. High resolution AFM scanning Moire method and its application to the micro-deformation in the BGA electronic package, MICROELECTRONICS RELIABILITY, Volume: 42, Issue: 8, Pages: 1219-1227, Article Number: PII S0026-2714(02)00084-7, 2002. (pdf)

41. Zhong, ZW. Surface finish of precision machined advanced materials, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, Volume: 122, Issue: 2-3, Pages: 173-178, 2002. Article Number: PII S0924-0136(02)00076-6. (pdf)

42. Lu, YG; Zhong, ZW; Yu, J; et al. Thermal deformation measurement of electronic packages using the atomic force microscope scanning moire technique, REVIEW OF SCIENTIFIC INSTRUMENTS, Volume: 72, Issue: 4, Pages: 2180-2185, 2001. (pdf)

43. Zhong, ZW; Goh, KS. Analysis and experiments of ball deformation for ultra-fine-pitch wire bonding, JOURNAL OF ELECTRONICS MANUFACTURING, Volume: 10, Issue: 4, Pages: 211-217, 2000. (pdf)

44. Zhong, ZW; Hung, NP. Diamond turning and grinding of aluminum-based metal matrix composites, MATERIALS AND MANUFACTURING PROCESSES, Volume: 15, Issue: 6, Pages: 853-865, 2000. (pdf)

45. Hung, NP; Tan, TC; Zhong, ZW; et al. Ductile-regime machining of particle-reinforced metal matrix composites, MACHINING SCIENCE AND TECHNOLOGY, Volume: 3, Issue: 2, Pages:255-271, 1999. (pdf)

46. Zhong, Z; Nakagawa, T. Grinding of aspherical SiC mirrors, JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, Volume: 56, Issue: 1-4, Pages: 37-44, 1996. (pdf)

47. Zhong, ZW; Nakagawa, T. Development of a micro-displacement table for ultra-precision machining and grinding for curved surfaces by the use of it, INTERNATIONAL JOURNAL OF THE JAPAN SOCIETY FOR PRECISION ENGINEERING, Volume: 26, Issue: 2, Pages: 102-107, 1992. (pdf)

OTHER INFORMATION

· Lian He Zao Bao (Newspaper in Singapore, 12 July 2005) reported that my PhD student set a new NTU record to obtain a PhD degree in 2 years, the minimal time required.

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