Multiphysics Modeling – LI Hua at NTU
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Research Interests
  1. Multiphysics modeling of soft matters – Smart hydrogel in bioMEMS & Biological cell in microscale field
  2. Machine learning based prediction – Physics-informed and data-driven analysis for correlation among 3D printing process parameters, microstructures and mechanical properties of additively manufactured part
  3. Development of highly efficient numerical computational methodology – Meshless & Multiscale algorithms
  4. Simulation of sustainable energy – Building energy efficiency & Fuel cell system
  5. Dynamics – High-speed rotating shell & Composite materials structure
More Information
  1. Industrial Collaborators: CAAS, Rolls-Royce, Makino, Emerson, Lloyd's Register, ABB, SUN Microsystems (Oracle), Sony, Philips, GE, DSO, JTC, A*STAR-ARTC.
  2. Industrial Consultancy: Teng Yong Ng and Hua Li, “Involving Aircraft and Towbarless Air Tug which Veered off Taxiway onto Grass Verge during Towing Operations at Singapore Changi Airport on 31 December 2015”, Consultancy for Changi Airport Group, Reported on 21 July 2016.
  3. US patent: Chidanand Hegde, Joel Chin Huat Lim and Hua Li, “In-situ Synthesis and Deposition of High Entropy Alloy and Multi Metal Oxide Nano/Micro particles by Femtosecond Laser Direct Writing” (ADS00271.0005.00PRO, filled in provisional). This provisional patent was filed on 16th October 2020, and the patent has been filed finally on 21st April 2022 (US patent – Pub. No.: US 2022/0121122 A1).
  4. “One of the top 10 most-cited papers among work published in the journal between 1 January and 31 December 2023”, Citation data from Clarivate Analytics, sent by John Wiley & Sons, on 19 March 2025. – Zhixin Zhan (RF), Xiaofan He, Dingcheng Tang, Linwei Dang, Ao Li, Qianyu Xia, Filippo Berto and Hua Li (Corresponding author), Recent developments and future trends in fatigue life assessment of additively manufactured metals with particular emphasis on machine learning modelling, Fatigue & Fracture of Engineering Materials & Structures, Vol. 46, pp.4425–4464, 2023 (Invited Review Paper).

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