Research Facilities

Thin film deposition/device fabrication facilities:

  • Electrodeposition system
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  • Spin coater
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  • Large area autospray system
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  • Screen printer
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  • High Temperature Vacuum Oven
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  • Sputtering System
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  • Thermal Evaporator
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  • Atomic Layer Deposition
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  • Solar Simulator (AM 1.5 )
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  • Rapid Thermal Annealing
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  • IPCE setup
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  • Photoelectrochemical setup
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  • DC Hall measurement
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  • AC Hall measurement (dveloped by IBM)
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  • DLP 3D Printer -
    Asiga Pico-2, Asiga Pico Max
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  • Stratasys Polyjet 3D Printer -
    Objet260 connex3
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  • FDM multi-material 3D Printer
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  • Binder jet 3D printer
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  • Inkjet Printer
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  • Extrusion 3D printer - Hyrel
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    Shared Characterization faciliites:

  • Field Emission - Scanning
    Electron Microscope (FE-SEM)
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  • Energy Dispersive X-ray (EDX)
    spectroscopy
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  • X-Ray Diffraction (XRD) Microscopy
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  • Gas chromatography
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  • Photoluminescence setup
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  • Atomic Force Microscopy (AFM)
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    SEM-EDX machine

     

    Our research

    You may want to check our research section to find out and understand more about our current research topic and facilities
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    Please also check out our latest publication!
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